Perfluoropolyether fluid
Fluorine fluid: CL175 CAS number: 60164-51-4
Product Introduction
Perfluoropolyether fluid is a perfluoropolyether product with low polymerization degree, low molecular weight, low boiling point, and low viscosity. Compared with other fluorinated fluids on the market (hydrofluoroethers, hydrofluorocarbons, perfluorocarbons, perfluoroketones), it has more stable properties and is more environmentally friendly compared to perfluorocarbons.
Application
- Liquid coolingUsed for liquid cooling and immersion liquid cooling of data center servers, without the need for air conditioning cooling, greatly reducing the power consumption of the data center. The PUE reaches below 1.1, saving more than 85% energy compared to traditional air conditioning air cooling;
- Heat transfer fluidUsed in the semiconductor and electronics, fuel cell, and solar industries, primarily for controlling or maintaining process temperatures at a certain set level to avoid potential hazards of material damage;
- Electronic testing fluidSuitable for reliability testing in the semiconductor and electronics industries, including thermal shock and airtightness testing;
- Gas phase welding fluidUsing the latent heat of fluorine fluid vapor condensation to melt solder paste and obtain reliable metal contacts, this product has a narrow temperature range and more precise temperature control. Its higher boiling point can meet the higher working temperature range of lead-free solder;
- Electronic cleaning fluidFluorine fluid is colorless, odorless, non-toxic, with low surface tension and good permeability. It has excellent cleaning effect on small and stubborn dirt, and is a specialized cleaning solution for electronic components and circuit boards;
- Acid spill treatmentFluorine fluid has the characteristics of chemical inertness, strong hydrophobicity, high density (lower than fuming sulfuric acid), non flammability, etc., and is completely incompatible with fuming sulfuric acid. It can be used as a continuous covering material to alleviate the formation of fuming sulfuric acid and sulfuric acid leakage.
Technical Parameter
| Polyether fluid | Unit | CL175 |
|---|---|---|
| Boiling point | ℃ | 200 |
| Pour point | ℃ | -95 |
| Density 25℃ | g/cm³ | 1.78 |
| Density -54℃ | g/cm³ | 1.96 |
| Kinematic viscosity 25℃ | cSt | 3.6 |
| Kinematic viscosity -54℃ | cSt | 65 |
| Steam pressure 25℃ | kPa | <0.3 |
| Specific heat 25℃ | J /Kg°C | 1191 |
| Heat of vaporization at boiling point | J/g | 67 |
| Thermal conductivity at 25℃ | w/m- °C | 0.07 |
| Coefficient of expansion | ℃⁻¹ | 0.0012 |
| Surface tension 25℃ | dynes/ cm | 15 |
| Dielectric 25℃ | KV-2.54mm gap | 40 |
| Dielectric constant 25℃(1kHz) | 一 | <2 |
| Dissipation factor 25℃ (1kHz) | 一 | <0.01 |
| Volume resistivity 25℃ | Ohm- cm | 6X10¹⁵ |
| Water content | ppm( wt) | <30 |
| Air solubility | cm³ gas /100cm³ | 26 |
| Molecular weight | 800 | |
| ODP | 0 | |
| GWP | ℃ | >5000 |
| Thermal decomposition temperature | >290 |
